As quickly as the world of audio is developing, all of our headphones still use physical amplifiers to generate sound which is then pushed against a diaphragm and into our ears. This approach dates back over 100 years, but today xMEMS Labs offers an alternative with its Cypress ultrasonic solid-state speaker for TWS earphones. These speakers ditch physical amplifiers and instead rely on ultrasonic sound pulses that are normally inaudible to human hearing.
The key development made by xMEMS is the company’s ultrasonic amplitude modulation transduction. The speaker can generate ultrasonic sound pulses which are then sent to a demodulator to transform the sound pulses into audible sound for the user. The ultrasonic pulses offer an exact acoustic copy of the source signal which should result in superior audio reproduction across all sound frequencies. Cypress ultrasonic speakers are claimed to offer better quality and more detailed sound than coil speakers, while still supporting high-resolution and spatial audio.
xMEMS Cypress Ultrasonic Speaker
Each MEMS Cypress speaker fits into a small 6.3 x 6.5 x 1.65mm package and should also deliver stronger, deeper bass than conventional speakers. The company claims that its new ultrasonic speaker can produce a low-frequency sound pressure level (SPL) of 140 dB and go down to 20 Hz. Another advantage is the wider ANC bandwidth that allows earphones with Cypress MEMS speakers drown out unwanted high-frequency noises around you. The new speakers are also said to offer lower latency thanks to constant electric-to-acoustic conversion time.
xMEMS’ Cypress ultrasonic speakers will be unveiled at CES 2024, with mass production expected to begin in late 2024. The company has not yet shared pricing details, but revealed that it has reached a manufacturing partnership with TSMC that will will cost -competitive with mass market speakers for wireless headphones and earphones.
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