You can’t have missed the news that some iPhone 15 Pro series phones have been overheating. People have been complaining about the Pro models running hot since their launch.
Now, analyst Ming-Chi Kuo has released a note, concluding that the A17 Pro chipset is not responsible for the overheating but rather the compromises made by Apple in the design of the thermal system. The A17 Pro is built on TSMC’s new advanced 3nm node, which is very efficient, but apparently still puts out more heat than the phone can dissipate.
The culprit is Apple’s commitment to making the new iPhone Pro models lighter. Apple reportedly had to reduce the heat dissipation area, which, combined with titanium’s higher thermal conductivity, results in worse heat management for the new chipset.
Apple will likely fix the throttling issues with a software update, which may address but not fix the problem. The only way to actually prevent a phone from overheating with a software update is to limit its performance and, therefore, power requirements so that it generates less heat.
Kuo’s theory doesn’t fully explain why only a portion of phones are affected. We’re not experiencing any overheating in our test units for what it’s worth, and forums discussing the issue have plenty of responses from people unable to replicate the problem. Could it be that different phones have different cooling pad materials? We will make sure to follow it and keep you updated.
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