TSMC introduced the N4 node last year as an extension of its N5 node, often referred to as “4 nm” and “5 nm”, but they belong to the same family. The company plans to begin shipping chips built on a next-generation node, N3, by the end of the year.
The evolution of TSMC nodes
Node N3 will reportedly be used for some upcoming iPads. However, the next major upgrade to Apple’s silicon will build on the upgraded N3E node – this will improve performance and efficiency, and (even better) it’s designed to be more affordable.
The evolution of TSMC nodes: N4 • N3 • N3E (image credit)
The N3E node will be used for the Apple A17, he reports Nikkei Asia, and will go into mass production in the second half of next year. The next series of Mac chips, the M3, are also expected to use N3E.
The current Apple A16 chip is produced on node N4, as Dimensity 9000/9000 + and Snapdragon 8+ Gen 1, and is exclusive to the iPhone 14 Pro duo. The vanilla iPhone 14 pair uses last year’s A15 (N5).
Analysts believe the situation next year will be similar with the A17 chip reserved for iPhone 15 Pro models, while non-Pro phones will use a less advanced node (the A16 chip is the more likely choice).
Note that these nodes (N5, N4 and N3) still use FinFet projects, although TSMC has developed “FinFlex” for nodes N3 and N3E. This will allow customers to change the balance between chip speed and chip size to suit their needs. Gate-All-Around (nanosheet-based) projects will come with TSMC’s N2 node.
Different fin configurations for N3E and how they compare to an N5 chip
Samsung is already shipping chips built on its 3nm node and using a Gate-All-Around design. Intel initially struck a deal to produce some 3nm chips at TSMC’s foundries this year or early next year, but three insiders say the order has been postponed to 2024.
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