The Redmi K70 Pro was presented to the Chinese market just a few hours ago, and already a local channel has performed a teardown of the device, showing all its internal parts in all their splendor.
This is easily the highest-end Redmi smartphone ever made and features what is currently Qualcomm’s best chipset, which is a first for the brand, certainly fitting for its 10th anniversary. Did we mention that Redmi turned ten this year? Well, it did. Anyway, if you don’t speak Chinese, don’t worry: English subtitles are available, just hit the CC button in the player below.
The teardown reveals a lot of details about the components used for the phone, including the camera sensors and the manufacturers of all the various chipsets on board. It is a very informative and fast-paced journey, which we recommend taking.
In summary, the Redmi K70 Pro is equipped with a 6.67-inch OLED screen with 1440×3200 120 Hz resolution with peak brightness of 4,000 nits, Snapdragon 8 Gen 3 SoC, 12/16/24 GB of RAM, 256 GB/ 512GB/1TB of storage, a triple rear camera system (50MP main with OIS, 12MP ultrawide, 50MP 2x optical zoom), a 16MP selfie snapper, and a 5,000mAh battery with support 120W wired charging.
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