Lenovo will unveil a Legion Y70 smartphone on August 18, and the company has already revealed the main specifications of the new flagship. Today continued with a series of teasers, revealing more about the phone’s cooling capabilities.
The company will introduce a huge 5,047mm2 VC cooling system with a thickness of only 0.55mm. That’s right, the camera will have a profile of half a millimeter.
Awesome Lenovo Legion Y70 teasers
Lenovo Legion Y70 will have an extremely thin profile overall – advertised is 7.99mm, which is the thickness of the base without the protruding 50MP camera with OIS.
It will somehow manage to bring 10 layers of heat dissipation materials and solutions, and the phone is advertised next to a fridge because the obvious references are obvious.
As we can see, the new Legion smartphone wants to maintain the sub-brand’s gaming legacy while maintaining a friendlier look for the average consumer.
There will be no shoulder triggers or a heavily modified UI for mobile gaming-oriented users, but still expected to maintain peak performance with a Snapdragon 8+ Gen 1, 68W fast charging, and up to 16GB of RAM.
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