Samsung today announced an updated version of its 16Gb DDR5 DRAM. The memory is built on the 12nm class process technology, upgrading from the 14nm EUV product currently on the market.
The new DDR5 DRAM was also announced to be compatible with AMD products: it has been optimized and validated on Zen platforms.
Jooyoung Lee, EVP of DRAM Product & Technology at Samsung, said the new standard would be a key factor in driving market-wide adoption of DDR5 DRAM.
It is manufactured with the use of a new material that increases cell capacity and a proprietary design technology that improves critical circuit characteristics.
The new DRAM is based on EUV (Extreme ultraviolet) lithography, which enables higher die density and 20% better wafer throughput. It also consumes 23% less energy, paving the way for better green operations among IT companies.
The first memory sticks with the new DDR5 DRAM are expected to begin shipping in 2023.
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