Mediatek has announced the Dimensity 1050, its first chipset with mmWave 5G support. It will enable seamless connectivity through easy switching between Sub-6GHz and mmWave standards. It is built by TSMC on a 6nm process, and the company has promised devices with the chip as early as the third quarter of 2022.
The Taiwanese company has also introduced its Wi-Fi 7 platforms in Filogic 880 and Filogic 380 with Wi-Fi 7 and Bluetooth 5.3 integration.
Media library size 1050
Dimensity 1050 has an octa-core CPU – two Cortex-A78 drives at 2.5 GHz and six Cortex-A55 at 2.0 GHz – and a Mali-G610 MC3 GPU. The mmWave comes with a 4CC carrier aggregation, while Sub-6 is limited to 3CC.
Finally, Mediatek brought two additional chips to the stage to power tomorrow’s mid-range phones. One is the Dimensity 930 with faster connectivity than the 920 and support for Full HD + 120Hz displays with HDR10 +. The second is Helio G99, which is an evolution of the LTE-only Helio G96, built on the 6nm platform, instead of 12nm.
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